Ye Tianchun Urges Chinese Tech Firms to Prioritize Legacy Chips Amid US Technological Blockades In a significant strategic shift, Chinese tech companies are being advised to focus on innovations using mature process nodes and advanced packaging technologies rather than pursuing cutting-edge process nodes. This advice comes from Ye Tianchun, President of the Integrated Circuit Branch of the China Semiconductor Industry Association (CSIA) and Secretary-General of the China Integrated Circuit Innovation Alliance (CICIA). His call to action emerges in response to the ongoing technological blockade by the US, which restricts China’s access to the latest semiconductor technologies. US Technological Blockades and China's Response The United States has implemented strict measures to prevent China from acquiring advanced chips and the necessary tools for cutting-edge chip manufacturing. This includes blocking exports of high-end chips and prohibiting companies like ASML from servicing the...
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